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AIR MFC is a fully modular and configurable mechanical frame capable to host different equipment and operator HCI. Main components are carbon-fiber made. Arrangements and operating configurations are available starting from a very small set of mechanical elements easily managed and assembled even in field.

  • Advanced composite carbon fiber infrastructure
  • 463L pallet system mechanical interface
  • Less than 250 Kg total weight
  • Roll-on/Roll-off, rapid deployement
  • Modular and scalable architecture
  • Tactical Data Link (TDL) capability
  • Flying network node
  • Air/Ground Command and Control System

AIR MFC is normally assembled on a standard avionic pallet to grant very loose mechanical coupling toward the aircraft. A carbon fiber mission seat solution is also available for further total weight reduction.

After a long experience in infrastructure design for electronics, Elesia presents the ECR a family of Electronics Enclosures Cabinets and Racks, designed according to the MIL standards and built using the last generation of composite materials. Are denominated in this way the materials obtained by the union of at least two components which have chemical-physical characteristics that make them different, insoluble and separated between them.

The Elesia's ECR represents a real breakthrough in the development of military enclosures and rack made with innovative technologies and modern fabrication processes. Such an equipments are tailored to your specific application to ensure all system requirements are met with the most optimized packaging. Elesia enclosure offerings are based on proven, cost effective designs and are deployed across several surface ships and aircraft spanning multiple programs.

These materials are defined as fiber and matrix (epoxy resin). The union of these elements give a continuous solid material which is capable of propagate and redistribute the internal forces caused by external stresses.

Elesia can build its composite equipments combining features to create a custom configuration, or make special modifications as required for a specific application.

The addition of 50% of continuous carbon fibers in an epoxy resin matrix produce a structure which, stressed in tension, also has a stiffness of 2 times higher than an equivalent steel structure of the same size. The elastic modulus of the composite can reach 400 GPa, double of the steel, with a breaking strength 4-5 times more high.

Meets custom requirements;
Multi-role and Multi-mission;
Suitable for Air, Naval and Ground systems;
No maintenance, no corrosion;
Modular and scalable;
High thermal efficiency;
High Reliability;
Low cost.
Physical Dimensions (base x height x depth) 1524 x from 915 to TBD x 635
Weight 18 kilograms
Payload 92,5 kilograms
Compliant to   MIL-S-901D

The M3S system is composed of two main units interconnected electrically and mechanically

  • The HCI (Human Computer Interface) unit;
  • The P&IO (Processing and Input Output) unit.

The system is equipped with a very sophisticated mechanical and electrical structure made of composite materials, one of the most modern application software for finite element method (FEM) has been used by Elesia to design the M3S. State of the art flex and rigid-flex pcb technology are used on the entire system. This approach ensures a high resistance of the supporting structure to the shock and vibrations.

The M3S is normally installed on a 463L family pallet (88"x108" or its subsize) or by using the seat rails. This method is widely used for transport planes like the C-130, C-27 or the CH-47 and EH-101 helicopters. The basement, made in fiber carbon, is an integral part of the system.

The HCI unit comprises two high resolution displays (the dimensions are variable, depending on the type of application). A keyboard and a trackball (or a joystick) for cursor control are available. On the sides of the unit is available an Intercomm control panel for internal voice comms, as well as for remote control of on-board radios.

Depending on the M3S configuration, the two displays can be configured either as stand-alone components driven by the CPU contained in the P&IO unit or as two displays, each one with a powerful embedded PC connected via LAN to the P&IO itself. This solution allows the optimization of the space available for other processing units or I/O.

Many configurations are possible on the P&IO. Elesia is able to provide boards, modules and sw for applications like:

  • C&C;