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PC3-ALLEGRO CompactPCI® PlusIO • CPU Card

EKF presents the PC3-ALLEGRO, a rich featured high performance CompactPCI® PlusIO CPU board, equipped with an Intel® Core™ i7 mobile processor. The PC3-ALLEGRO front panel is provided with two Gigabit Ethernet jacks, two USB 3.0 receptacles, and two Mini-DisplayPort connectors for attachment of high resolution digital displays

The PC3-ALLEGRO is equipped with up to 16GB RAM with ECC support. The backplane connectors comply with the PICMG® CompactPCI® PlusIO system slot specification, suitable for rear I/O or hybrid CompactPCI® Serial systems. Several low profile SATA SSD mezzanine modules are available as mass storage solution.

CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller

  • J1 Connector for Full CompactPCI® Classic 32-Bit Support
  • J2 Connector (UHM High Speed) for CompactPCI® PlusIO Support
  • 4 x PCIe
  • 4 x SATA
  • 4 x USB
  • 2 x Gb

Proven Intel® Mobile CPU Technology

  • 3rd Generation Intel® Core™ Mobile + ECC CPU, Code Name Ivy Bridge
  • i7-3612QE Processor 2.1GHz • 35W TDP Standard Voltage Quad-Core
  • i7-3555LE Processor 2.5GHz • 25W TDP Low Voltage Dual-Core
  • i7-3517UE Processor 1.7GHz • 17W TDP Ultra Low Voltage Dual-Core
  • i5-3610ME Processor 2.7GHz • 35W TDP Standard Voltage Dual-Core
  • i3-3120ME Processor 2.4GHz • 35W TDP Standard Voltage Dual-Core
  • i3-3217UE Processor 1.6GHz • 17W TDP Ultra Low Voltage Dual-Core
  • Intel® QM77 Panther Point Platform Controller Hub (PCH)

SATA 6G & 3G for Mass Storage

  • 2 + 2 SATA Channels 6Gbps/3Gbps for Mezzanine Storage Modules (Connector HSE)
  • CompactFlash® Card with C40-SCFA Mezzanine Module Option (4HP Maintained)
  • CFast™ Card with C41-CFAST Mezzanine Module Option (4HP Profile Maintained)
  • SATA 1.8-Inch Solid State Drive with C42-SATA Mezzanine Card Option (4HP Maintained)
  • Dual mSATA Modules with C47-MSATA RAID Mezzanine Card Option (4HP Maintained)
  • 4 x SATA RAID Channels to UHM Connector J2, for RIO Module or CPCI Serial Backplane Usage, limited to 3G SATA by CPCI PlusIO Specification
  • Hardware RAID Enabled by Marvell 88SE9230 ARM Powered Subsystem
  • RAID Configuration Level 0/1/10

Set of Mezzanine Connectors for Storage Module or Side Card

  • Legacy I/O Mezzanine Expansion Connector EXP (USB, HD Audio, LPC)
  • High Speed I/O Mezzanine Expansion Connector HSE (4 x SATA, 4 x USB)
  • PCI Express® Mezzanine Expansion Connector PCIE (4 Lanes)
  • Third Display Mezzanine Expansion Connector SDVO/DP
  • Variety of Mezzanine Expansion Boards (Side Cards) Available
  • Most Mezzanines Optionally Equipped with 2.5-Inch Single- or Dual-Drive
  • Low Profile Storage Modules Maintain 4HP F/P Width
  • Side Cards with Additional Front Panel I/O Connectors (8HP & 12HP Assembly)

Best Suited e.g. for Industrial, Transportation & Instrumentation Applications

  • Long Term Availability
  • Rugged Solution
  • Coating, Sealing, Underfilling Available on Request

Integrated HD Graphics Engine, 3 Independent Displays, Enhanced Media Processing

  • Up to 3 Display Configuration (Front Panel: Dual mDP or Single VGA Connector Option)
  • Max Resolution 2560 x 1600 (DisplayPort), 1920 x 1200 (VGA)
  • 3rd Display via Side Card PCS-BALLET

Integrated Memory Controller up to 16GB DDR3 +ECC 1600

  • DDR3 +ECC Soldered Memory up to 8GB
  • DDR3 +ECC SO-DIMM Memory Module Socket up to 8GB

USB 3.0 XHCI SuperSpeed & USB 2.0 EHCI Support

  • 2 x USB 3.0 F/P Connectors
  • 6 x USB 2.0 to Mezzanine Connectors
  • 4 x USB 2.0 to J2 (Backplane)

Gigabit Ethernet Controllers

  • 2 x GbE F/P RJ-45 Jacks
  • 2 x GbE to Backplane Connector J2

PCI Express® Based Design for Component Interconnect

  • PCI Express® for System Expansion by Mezzanine and Backplane or RIO
  • 4 x PCI Express® Gen2 Lanes to CPCI PlusIO Backplane J2 Connector
  • 4 x PCI Express® Gen2 Lanes to Mezzanine Connector

UEFI Phoenix BIOS with ACPI

  • Windows® and Linux Support (Others on Request)

Regulation & Environmental

  • RoHS compliant 2002/95/EC
  • EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
  • Operating Temperature: 0°C to +65°C (Industrial Temperature Range on Request)
  • Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
  • Humidity 5% ... 95% RH non Condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF 104 x 103 h (11.9 years) @ 50°C