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RE0813 Rugged Embedded Computer

  • Designed to MIL-STD-810, MIL-STD-461, and IEC-61850-3
  • Extreme temperature performance: -40°C to +85°C
  • Compact 1U or tray mounted display
  • Up to three SSD hard drives
  • Intel Core i3 or i5 options
  • Compact aluminum construction - 11"x16.5" footprint
  • Power efficient Intel Core i3 and Core i7 options
  • Up to three (3) SSD hard drives
  • Redundant, extended temperature cooling fans
  • billet construction from milled and strain hardened 6061T651 structural aircraft aluminum
  • Panel or rack mounting options

Compact and Powerful

With an all aluminum chassis footprint, the RE0813 provides a small package with big capabilities. The unit was optimized for remote applications requiring powerful processing on a tight power budget. Don't wait for the next "rugged" Intel architecture when you can make your program successful now!

Rugged and Dependable

Using our expertise in embedded computer design and development, we've created the next generation in rugged computing. This game-changing technology provides enhanced compute power in the harshest of environments. We do not merely design to these standards, we actually test to them. When we put our name on the RE0813, you can be sure it is both rugged and dependable.

High Reliability at a Fraction of the Cost

Innovative packaging techniques and attention to the important details makes our product run cooler and perform at wider temperature extremes. Design approach limits deflection and extends circuit board solder joint life. We provide incredible processing power, in a rugged package, with exceptional life at a fraction of the cost.

Testing Standards

Operational Temperature, MIL-STD-810, Method 501, Procedure I/II -40°C to +70°C, +85°C with select configurations
Storage, MIL-STD-810, Method 501, Procedure I/II -40°C to +85°C
Humidity, MIL-STD-810, Method 507 240 Hour with humidity kit
Altitude, MIL-STD-810, Method 500 12,500ft operation, 40,000ft transport
Vibration, MIL-STD-810, Method 514, Procedure I 5.5 GRMS, 5-500Hz, 60 min/axis, 3 axes
Emission radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A
IEC 61850-3  

Mechanical (6U)

Height 1.75" (4.4 cm) max
Width 16.5" (41.9 cm)
Depth 11" (27.9 cm) excluding connectors
Weight 7.5 lbs (3.4 kg)
Power 55-80W with select configurations, CPU dependent

Internal Bay

One, two, or three, or four SATA 2.5" SSD (not externally removable)

Expandable

One PCIe X16 low profile

Cooling

Extended temperature range with forced convection (fan included), requires 1.5" clearance front and rear for full thermal performance

Mounting

Panel mounting via ears on base

Power Supply

90-250 VAC 50/60Hz with locking power cord

System Board Options

(Note, these features are at the board level and may not all be available in the standard configuration)
X9SPV-LN4F-3LE, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3
X9SPV-LN4F-3QE, FCBGA1023, i7-3612QE CPU 2-16 GB ECC DDR3, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3
X9SPV-F-3610ME, FCBGA1023, i5-3610ME CPU, 2-16 GB ECC DDR3, 2-USB 2.0, 2-GBLAN, On-board SATA2 & SATA3
X9SPV-F-3217UE, FCBGA1023, i3- 3217UE CPU, 2-16 GB ECC DDR3, 2-USB 2.0, 2-GBLAN, On-board SATA2 & SATA3
X9SPV-M4-3QE, FCBGA1023, i7-3612QE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3
X9SPV-M4, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3
X9SPV-M4-3UE, FCBGA1023, i7-3517UE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Software Compatibility

Windows 7 or RHEL 5/6